CHAPTER 8: SAMPLE CONTACTS Click on any of the links below to download high resolution pdfs of any figure FIG. 8.1: Representative values of specific contact resistivity for high-Tc superconductors FIG. 8.2: Spring contact for convenient, quick changing of voltage contacts when testing many samples FIG. 8.3: Indium-pressure contacts for relatively low-current tapes FIG. 8.4: Auger electron spectroscopy depth profile for three contacts to YBCO: (a) indium-solder contact; (b) Ag/YBCO contact; and (c) Ag/YBCO contact fully oxygen annealed at 600°C for 1 h FIG. 8.5: Contact resistivity of Ag/YBCO interfaces at 4 K as a function of exposure time to air, CO2, N2, O2, and vacuum FIG. 8.6: Oxygen annealing characteristic for silver and gold contacts on sintered bulk YBCO FIG. 8.7: Oxygen annealing characteristic for silver contacts on bare bulk-sintered bismuth-based superconductors FIG. 8.8: Oxygen annealing characteristic for silver contacts on bare bulk-sintered thallium-based superconductors FIG. 8.9: Furnace arrangement for counter-flow oxygen annealing of high-Tc superconductor contacts FIG. 8.10: Diagram of contact resistance measurement technique FIG. 8.11: Effect of ion energy on sputter yield for sputter cleaning of contact surfaces FIG. 8.12: Contact resistivity as a function of annealing temperature for two silver thin-film contacts deposited on YBCO films FIG. 8.13: Optical micrograph of silver film annealed at 500°C, showing extensive agglomeration of silver that results in loss of electrical continuity through the contact pad FIG. 8.14: Contact resistivity as a function of annealing temperature for two gold thin films deposited on YBCO films FIG. 8.15: Configurations for measuring film interface resistivity FIG. 8.16: Stitch-bond arrangement for measuring the contact resistivity of wire-bond or ribbon-bond connections FIG. 8.17: Spreading resistance effect in thin contact pads References: Listing of all References for Chapter 8 Figures
